Watch the recording here. DENSsolutions recently held a live webinar on their new FIB Stub (3.0).
In situ heating and/or biasing TEM experiments attract a lot of interest from the community as it reveals the dynamic behaviour of the samples in the microscope that can be observed in real time. As the in situ TEM uses MEMS-based chips as sample carriers, the sample preparation, including the FIB lamellas need to be done onto Nano-Chips. Not only the lamellas need to be thin and clean from contamination, but for in situ heating and especially biasing experiments the samples need to remain functional.
In this Webinar, we will present our approach to the lamella sample preparation process on DENSsolutions’s Heating and Heating and Biasing Nano-Chips using our latest FIB stub. We will go through all steps of the lamella preparation including the lift out and the milling on the chip and discuss possible pitfalls that can be encountered during the whole process and how to overcome them. At the end of the presentation we will share a few examples of lamellas, prepared using DENSsolutions’ approach and used for heating and/or biasing in situ TEM experiments.
