New Magazine: Defence and Security Tech R&D
Read our new magazine – defence and security technology for research and development. Highlights include high-speed imaging, thermography, optics and ellipsometry.
Non-Destructive Testing
Centreline Segregation in Continuous Casting
Read this article for a detailed understanding of how μXRF technology enhances the detection and analysis of centerline segregation
Read our Non-Destructive Testing Magazine
Read this free magazine from QDUKI on non-destructive testing solutions – including case studies, white papers, articles and more
Automotive Showcase
Driving Future Needs of Composites in the Automotive Industry This showcase delves into the future needs of the automotive industry, focusing on the role of composite materials in addressing emergi
The Role of Thermographic Non-Destructive Testing
Using pulsed thermography for defence and security applications such as aircraft maintenance, structural health monitoring and more…
Showcasing Non-Destructive Testing Solutions
The very best in non-destructive testing solutions for aerospace, automated manufacture, failure analysis, forensics, pharmaceutical, archaeology and plastics and many more.
NDT Elemental Analysis with a microXRF Spectrometer
SEM-XRF : Integrated e⁻Beam / X-ray XRF Elemental Analysis – X-ray Sources for Electron Microscopy (SEM). microXRF is completely non-destructive and does not require the sample to be coated
Pulsed Thermography Applications
Today, pulsed thermography is widely used in the aerospace, power generation and automotive industry sectors all over the world. Much of this success is attributed to TWI’s vision and passion to
Non-Destructive Testing
Non destructive testing allows you detect flaws, measure thickness, and assess the condition of materials without making contact with, or destroying samples. We offer thermographic NDT with partne
Electronic / Semiconductor Testing Solution – E-LIT
E-LIT – Lock-In Thermography for Electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material d
