Welcome to Electronic Failure Analysis Magazine, brought to you by Quantum Design UK and Ireland.
As device geometries shrink and architectures grow increasingly complex, understanding failure mechanisms has never been more critical. In this edition, we explore cutting-edge methods that push the boundaries of what can be detected, measured, and understood.
Our contributors take you inside the challenges of analysing complex circuit failures in advanced interlayer structures and explain how ellipsometry is unlocking new perspectives in materials and interface evaluation. We also highlight techniques for identifying sub-20 nm defects and ultrathin residues—issues that can silently compromise semiconductor reliability. Beyond materials analysis, we examine how infrared imaging is enabling truly contactless electronic measurements, offering new insights during development and troubleshooting.
Contents:
- Analyse a Complex Circuit Failure in Interlayer Circuit Structures
- What Kinds of EFA Problems Can Benefit From Ellipsometry?
- Analysing sub-20 nm Defects and Ultrathin (~1 nm thick) Residues in Semiconductor Processes
- Advanced Imaging and Diffraction Tools for Transmission Electron Microscopy
- Infrared Camera Enables Contactless Measurement in Electronics
- CASE STUDY: STMicroelectronics implements E-LIT Solution in Two Plants
- GALLERY: Infrared Imagery
- Semiconductor Metrology
- Quantum Diamond Microscope for EFA
