DT-670 Silicon Diodes
DT-670 Series silicon diodes offer better accuracy over a wider temperature range than any previously marketed silicon diodes.
Conforming to the Curve DT-670 standard voltage versus temperature response curve, sensors within the DT-670 series are interchangeable, and for many applications do not require individual calibration. DT-670 sensors in the SD package are available in four tolerance bands—three for general cryogenic use across the 1.4 K to 500 K temperature range, and one that offers superior accuracy for applications from 30 K to room temperature. DT-670 sensors also come in a seventh tolerance band, B and E, which are available only as bare die. For applications requiring greater accuracy, DT-670-SD diodes are available with calibration across the full 1.4 K to 500 K temperature range.
The bare die sensor, the DT-670E-BR, provides the smallest physical size and fastest thermal response time of any silicon diode on the market today. This is an important advantage for applications where size and thermal response time are critical, including focal plane arrays and high temperature superconducting filters for cellular communication.
DT-621-HR miniature silicon diode
The DT-621 miniature silicon diode temperature sensor is configured for installation on flat surfaces. The DT-621 sensor package exhibits precise, monotonic temperature response over its useful range. The sensor chip is in direct contact with the epoxy dome, which causes increased voltage below 20 K and prevents full range Curve DT-670 conformity. For use below 20 K, calibration is required.
Diode thermometry
Diode thermometry is based on the temperature dependence of the forward voltage drop in a p-n junction biased at a constant current, typically 10 µA. Because the voltage signal is relatively large, between 0.1 V and 6 V, diodes are easy to use and instrumentation is straightforward.
The Lake Shore SD package —The most rugged, versatile package in the industry
The SD package, with direct sensor-to sapphire base mounting, hermetic seal, and brazed Kovar leads, provides the industry’s most rugged, versatile sensors with the best sample to chip connection. Designed so heat coming down the leads bypasses the chip, it can survive several thousand hours at 500 K (depending on model) and is compatible with most ultra high vacuum applications. It can be indium soldered to samples without shift in sensor calibration. If desired, the SD package is also available without Kovar leads.
Packaging Options:
DT-SD, CU/CU-HT, DI, BO, LR, CY, MT, ET, CO, DT-BR, DT-621-HR, DT-614-UN, temperature probes
DT-670-SD features
- Best accuracy across the widest useful temperature range—1.4 K to 500 K—of any silicon diode in the industry
- Tightest tolerances for applications from 30 K to 500 K of any silicon diode to date
- Rugged, reliable Lake Shore SD package designed to withstand repeated thermal cycling and minimise sensor self-heating
- Conformance to standard Curve DT-670 temperature response curve
- Variety of packaging options
DT-670E-BR features
- Temperature range: 1.4 K to 500 K
- Bare die sensors with the smallest size and fastest thermal response time of any silicon diode on the market today
- Non-magnetic sensor
DT-621-HR features
- Temperature range: 1.4 K to 325 K*
- Non-magnetic package
- Exposed flat substrate for surface mounting
*Calibrated down to 1.4 K, uncalibrated (Curve DT-670) to 20 K
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